Nippon Pillar Packing Co., Ltd.

City:

Country:

Japan

Published Applications:

Last publication date:

2009-03-12

Patent Grants:

Last grant date:

2011-05-10

Top Inventors for applications by Nippon Pillar Packing Co., Ltd.

These are the the leading inventors for applications assigned to Nippon Pillar Packing Co., Ltd.:

Tsunemori Yoshida 1 Kobe, Japan
Masayoshi Katsura 1 Hyogo, Japan
Masanobu Nishikawa 1 Osaka, Japan
Katsunori Sugita 1 Sanda, Japan

Isamu Ide 1 Sakai, Japan
Hisato Higuchi 1 Sakai, Japan

Recent patent applications by Nippon Pillar Packing Co., Ltd.

Nippon Pillar Packing Co., Ltd. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-03-12 ✅ Patent 7,938,452 granted on 2011-05-10

US20090066081A1

Mechanical engineering

Connecting structure between fluid device and joint

#2 | 2007-04-03 ✅ Patent 7,199,186 granted on 2007-04-03

US10211381

Carbon-phenol resin molding compound

AssigneeID:

439156 ⎘