Taoyuan County
Taiwan
13
2013-01-17
12
2014-06-03
These are the the leading inventors for applications assigned to PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.:
PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD. based in Taoyuan County, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Illuminating apparatus and method thereof
#2 | 2012-11-01 ✅ Patent 8,674,376 granted on 2014-03-18LED package structure
#3 | 2012-07-26 ✅ Patent 8,421,373 granted on 2013-04-16Light-mixing multichip package structure
#4 | 2012-04-26 ✅ Patent 9,078,312 granted on 2015-07-07Multichip package structure for directly electrically connecting to an AC power source
#5 | 2012-04-26 ✅ Patent 8,405,118 granted on 2013-03-26Multichip package structure using a constant voltage power supply
#6 | 2011-11-03 ✅ Patent 9,029,883 granted on 2015-05-12LED package structure with concave area for positioning heat-conducting substance
#7 | 2011-10-06 ✅ Patent 8,415,701 granted on 2013-04-09LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
#8 | 2011-03-10 ✅ Patent 8,288,777 granted on 2012-10-16LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same
#9 | 2011-03-03 ✅ Patent 8,018,151 granted on 2011-09-13Quasi-optical LED package structure for increasing color render index and brightness
#10 | 2011-01-13 ✅ Patent 8,008,099 granted on 2011-08-30LED package structure with concave area for positioning heat-conducting substance and method for manufacturing the same
#11 | 2011-01-06LED PACKAGE STRUCTURE FOR FORMING A STUFFED CONVEX LENS TO ADJUST LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME
#12 | 2010-12-30 ✅ Patent 8,187,899 granted on 2012-05-29LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
#13 | 2010-06-15 ✅ Patent 7,736,920 granted on 2010-06-15Led package structure with standby bonding pads for increasing wire-bonding yield and method for manufacturing the same
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