AI & DI Co., Ltd.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2014-11-18

Patent Grants:

Last grant date:

2014-11-18

Top Inventors for applications by AI & DI Co., Ltd.

These are the the leading inventors for applications assigned to AI & DI Co., Ltd.:

Atsumi IHARA 2 Osaka, Japan
Atsumi Ihara 1 Osaka-shi, Japan

Recent patent applications by AI & DI Co., Ltd.

AI & DI Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2014-11-18 ✅ Patent 8,888,095 granted on 2014-11-18

US14036859

Performing operations; transporting

Processing apparatus of cards and sheets

#2 | 2011-06-09 ✅ Patent 8,087,442 granted on 2012-01-03

US20110132547A1

Performing operations; transporting

Adhesive sheet bonding device

AssigneeID:

447301 ⎘