Thin Materials AG

City:

Eichnau, Delaware

Country:

United States

Published Applications:

Last publication date:

2009-07-09

Patent Grants:

Last grant date:

2012-05-08

Top Inventors for applications by Thin Materials AG

These are the the leading inventors for applications assigned to Thin Materials AG:

Volkmar Stenzel 1 Thedinghausen, Germany
Andreas Jakob 1 Starnberg, Germany
Klaus-D VISSING 1 Morsum, Germany

Recent patent applications by Thin Materials AG

Thin Materials AG based in Eichnau, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-07-09 ✅ Patent 8,173,522 granted on 2012-05-08

US20090176349A1

Electricity

Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer

AssigneeID:

451931 ⎘