South Korea
9
2017-03-30
9
2018-02-27
These are the the leading inventors for applications assigned to STS Semiconductor & Telecommunications Co., Ltd.:
STS Semiconductor & Telecommunications Co., Ltd. based in , KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Wafer level fan-out package and method for manufacturing the same
#2 | 2016-12-15 ✅ Patent 9,905,551 granted on 2018-02-27Method of manufacturing wafer level packaging including through encapsulation vias
#3 | 2016-10-11 ✅ Patent 9,466,586 granted on 2016-10-11Method for manufacturing wafer-level fan-out package
#4 | 2016-09-20 ✅ Patent 9,449,911 granted on 2016-09-20Fan-out wafer level package and manufacturing method thereof
#5 | 2015-08-13 ✅ Patent 9,349,667 granted on 2016-05-24Method of manufacturing stacked package
#6 | 2013-04-04 ✅ Patent 8,952,514 granted on 2015-02-10Semiconductor package
#7 | 2013-01-17 ✅ Patent 9,024,452 granted on 2015-05-05Semiconductor package comprising an interposer and method of manufacturing the same
#8 | 2010-12-09 ✅ Patent 8,222,120 granted on 2012-07-17Method of dicing wafer using plasma
#9 | 2010-11-04 ✅ Patent 8,202,744 granted on 2012-06-19Wafer through silicon via forming method and equipment therefor
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