Powertech Technology Inc.

City:

Hukou, Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2011-10-27

Patent Grants:

Last grant date:

2012-10-30

Top Inventors for applications by Powertech Technology Inc.

These are the the leading inventors for applications assigned to Powertech Technology Inc.:

Wen-Jeng FAN 1 Hsinchu, Taiwan
Wen-Jeng FAN 1 Hukou, Taiwan

Recent patent applications by Powertech Technology Inc.

Powertech Technology Inc. based in Hukou, Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-10-27 ✅ Patent 8,299,587 granted on 2012-10-30

US20110260306A1

Electricity

Lead frame package structure for side-by-side disposed chips

AssigneeID:

458158 ⎘