Byfield, Massachusetts
United States
3
2011-05-12
3
2014-08-05
These are the the leading inventors for applications assigned to Diemat, Inc.:
Diemat, Inc. based in Byfield, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Adhesives with thermal conductivity enhanced by mixed silver fillers
#2 | 2010-03-18 ✅ Patent 8,344,523 granted on 2013-01-01Conductive composition
#3 | 2005-05-31 ✅ Patent 6,901,203 granted on 2005-05-31Fiber optic feed-through tube and method for making the same
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