Charm Engineering Co., Ltd.

City:

Country:

South Korea

Published Applications:

Last publication date:

2011-02-03

Patent Grants:

Last grant date:

2013-02-12

Top Inventors for applications by Charm Engineering Co., Ltd.

These are the the leading inventors for applications assigned to Charm Engineering Co., Ltd.:

Young-Ki HAN 3 Seoul, South Korea
Jung Hee Lee 2 Incheon, South Korea
Young Soo Seo 2 Gyeonggi-Do, South Korea
Jae Chul Choi 2 Gyeonggi-Do, South Korea

Kwan Goo Rha 2 Gyeonggi-do, South Korea
Chul Hee Jang 1 Gyeonggi-Do, South Korea
Jae Chul Choi 1 Osan-Si, South Korea
Hyoung-Won KIM 1 Gyeonggi-do, South Korea

Jae Choi 1 Gyeonggi-do, South Korea
Sun Q Jeon 1 Gyeonggi-do, South Korea
Yong Hwan Lim 1 Jeollabuk-Do, South Korea
Hee-Se Lee 1 Gyeonggi-do, South Korea

Young Soo SEO 1 Hwaseong-si, South Korea
Chi Kug YOON 1 Anseong-si, South Korea
Kyung-Ho LEE 1 Gyeonggi-do, South Korea
Hyoung Won Kim 1 Suwon-Si, South Korea

Dong Wan KIM 1 Gyeonggi-do, South Korea
Chi Kug Yoon 1 Gyeonggi-Do, South Korea
Seng Hyun Chung 1 Gyeonggi-do, South Korea
Jae Ho Guahk 1 Gyeonggi-do, South Korea

Jun-Hyeok LEE 1 Osan-Si, South Korea
Hyang Joo Lee 1 Gyeonggi-Do, South Korea
Jun Hyeok Lee 1 Gyeonggi-Do, South Korea
Won Haeng Lee 1 Chungcheongnam-Do, South Korea

Recent patent applications by Charm Engineering Co., Ltd.

Charm Engineering Co., Ltd. based in , KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-02-03 ✅ Patent 8,373,086 granted on 2013-02-12

US20110024399A1

Electricity

Plasma processing apparatus and method for plasma processing

#2 | 2010-11-18 ✅ Patent 8,864,936 granted on 2014-10-21

US20100288728A1

Electricity

Apparatus and method for processing substrate

#3 | 2010-04-22 ✅ Patent 8,980,049 granted on 2015-03-17

US20100096084A1

Electricity

Apparatus for supporting substrate and plasma etching apparatus having the same

#4 | 2010-03-11 ✅ Patent 8,888,950 granted on 2014-11-18

US20100059478A1

Electricity

Apparatus for plasma processing and method for plasma processing

AssigneeID:

461847 ⎘