Kun Yuan Technology Co., Ltd.

City:

Country:

Taiwan

Published Applications:

Last publication date:

2012-03-22

Patent Grants:

Last grant date:

2013-04-16

Top Inventors for applications by Kun Yuan Technology Co., Ltd.

These are the the leading inventors for applications assigned to Kun Yuan Technology Co., Ltd.:

Chiao-Jung Yeh 1 Miao-Li, Taiwan
Cheng-Ho HSU 1 Miao-Li, Taiwan
Kuei Pin Wan 1 Chu-Nan, Taiwan
Chiao-Jung Yeh 1 Chu-Nan, Taiwan

Kuei Pin WAN 1 Miao-Li, Taiwan
Cheng-Ho HSU 1 Chu-Nan, Taiwan
Cheng-Yu Hsia 1 Miao-Li, Taiwan
Cheng-Yu Hsia 1 Chu-Nan, Taiwan

Recent patent applications by Kun Yuan Technology Co., Ltd.

Kun Yuan Technology Co., Ltd. based in , TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-03-22 ✅ Patent 8,420,523 granted on 2013-04-16

US20120070943A1

Electricity

Chip packaging method and structure thereof

#2 | 2011-11-03 ✅ Patent 8,476,746 granted on 2013-07-02

US20110266662A1

Electricity

Package structure enhancing molding compound bondability

AssigneeID:

464211 ⎘