China Wafer Level CSP Ltd

City:

Country:

China

Published Applications:

Last publication date:

2013-09-05

Patent Grants:

Last grant date:

2015-02-10

Top Inventors for applications by China Wafer Level CSP Ltd

These are the the leading inventors for applications assigned to China Wafer Level CSP Ltd:

Wenbin WANG 1 Jiang Su Province, China
Wenbin WANG 1 Jiang Su, China
Junjie LI 1 Jiang Su Province, China
Guoqing YU 1 Jiang Su Province, China

Guoqing YU 1 Jiang Su, China
Wei WANG 1 Jiang Su Province, China
Qiuhong ZOU 1 Jiang Su, China
Junjie LI 1 Jiang Su, China

Qiuhong ZOU 1 Jiang Su Province, China
Wei WANG 1 Jiang Su, China

Recent patent applications by China Wafer Level CSP Ltd

China Wafer Level CSP Ltd based in , CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2013-09-05 ✅ Patent 8,952,512 granted on 2015-02-10

US20130228817A1

Electricity

Wafer-level package structure of light emitting diode and manufacturing method thereof

#2 | 2011-01-13 ✅ Patent 8,445,919 granted on 2013-05-21

US20110006322A1

Electricity

Wafer-level package structure of light emitting diode and manufacturing method thereof

AssigneeID:

465460 ⎘