Headway Technologies, Inc.

City:

Milpitas, Arizona

Country:

United States

Published Applications:

Last publication date:

2011-11-03

Patent Grants:

Last grant date:

2013-06-04

Top Inventors for applications by Headway Technologies, Inc.

These are the the leading inventors for applications assigned to Headway Technologies, Inc.:

Atsushi IIJIMA 1 Hong Kong, China
Tatsuya HARADA 1 Tokyo, Japan
Hiroyuki ITO 1 Milpitas, CA United States
Yoshitaka SASAKI 1 Milpitas, CA United States

Recent patent applications by Headway Technologies, Inc.

Headway Technologies, Inc. based in Milpitas, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-11-03 ✅ Patent 8,455,349 granted on 2013-06-04

US20110266692A1

Electricity

Layered chip package and method of manufacturing same

AssigneeID:

465913 ⎘