Chipbound Technology Corporation

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2012-03-29

Patent Grants:

Last grant date:

2013-06-25

Top Inventors for applications by Chipbound Technology Corporation

These are the the leading inventors for applications assigned to Chipbound Technology Corporation:

Hou-Chang Kuo 1 Kaohsiung City, Taiwan
Chia-Jung Tu 1 Zhudong Township Hsinchu County, Taiwan
Dueng-Shiu Tzou 1 Kaohsiung City, Taiwan
Gwo-Shyan Sheu 1 Kaohsiung City, Taiwan

Chin-Tang Hsieh 1 Kaohsiung, Taiwan
Chia-Jung Tu 1 Zhudong Township, Taiwan
Gwo-Shyan Sheu 1 Kaohsiung, Taiwan
Dueng-Shiu Tzou 1 Kaohsiung, Taiwan

Hou-Chang Kuo 1 Kaohsiung, Taiwan
Chin-Tang Hsieh 1 Kaohsiung City, Taiwan

Recent patent applications by Chipbound Technology Corporation

Chipbound Technology Corporation based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-03-29 ✅ Patent 8,471,372 granted on 2013-06-25

US20120074545A1

Electricity

Thin flip chip package structure

AssigneeID:

466793 ⎘