Micropack Co., Ltd.

City:

Country:

South Korea

Published Applications:

Last publication date:

2012-09-13

Patent Grants:

Last grant date:

2013-07-16

Top Inventors for applications by Micropack Co., Ltd.

These are the the leading inventors for applications assigned to Micropack Co., Ltd.:

Kyoung Lim SUK 1 Daejeon, South Korea
Kyung Wook Paik 1 Daejeon, South Korea
Jae Ok KIM 1 Seoul, South Korea
Deok Hoon KIM 1 Chungcheongbuk-Do, South Korea

Recent patent applications by Micropack Co., Ltd.

Micropack Co., Ltd. based in , KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-09-13 ✅ Patent 8,486,318 granted on 2013-07-16

US20120228805A1

Electricity

Fiber, fiber aggregate and adhesive having the same

AssigneeID:

467596 ⎘