Jhongli
Taiwan
11
2014-07-17
11
2015-02-10
These are the the leading inventors for applications assigned to Xintec, Inc.:
Xintec, Inc. based in Jhongli, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Chip package and method for forming the same
#2 | 2014-01-16 ✅ Patent 8,716,109 granted on 2014-05-06Chip package and fabrication method thereof
#3 | 2014-01-16 ✅ Patent 8,778,707 granted on 2014-07-15High-reflection submount for light-emitting diode package and fabrication method thereof
#4 | 2013-11-21 ✅ Patent 8,952,501 granted on 2015-02-10Chip package and method for forming the same
#5 | 2013-07-25 ✅ Patent 8,836,134 granted on 2014-09-16Semiconductor stacked package and method of fabricating the same
#6 | 2013-07-04 ✅ Patent 8,928,098 granted on 2015-01-06Semiconductor package and fabrication method thereof
#7 | 2012-09-27 ✅ Patent 8,624,362 granted on 2014-01-07IC wafer having electromagnetic shielding effects and method for making the same
#8 | 2012-05-31 ✅ Patent 8,878,367 granted on 2014-11-04Substrate structure with through vias
#9 | 2011-12-01 ✅ Patent 8,624,351 granted on 2014-01-07Package structure and method for making the same
#10 | 2011-09-22 ✅ Patent 8,536,672 granted on 2013-09-17Image sensor package and fabrication method thereof
#11 | 2011-08-18 ✅ Patent 8,558,262 granted on 2013-10-15High-reflection submount for light-emitting diode package and fabrication method thereof
Also check out Xintec Inc.'s (Jhongli, Taiwan) applicant profile with 25 patent applications submitted.
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