Lenddo, Limited

City:

Hong Kong

Country:

Hong Kong

Published Applications:

Last publication date:

2013-07-18

Patent Grants:

Last grant date:

2014-04-08

Top Inventors for applications by Lenddo, Limited

These are the the leading inventors for applications assigned to Lenddo, Limited:

Jeffrey Stewart 1 New York, NY United States

Recent patent applications by Lenddo, Limited

Lenddo, Limited based in Hong Kong, HK has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2013-07-18 ✅ Patent 8,694,401 granted on 2014-04-08

US20130185189A1

Physics

Systems and methods for using online social footprint for affecting lending performance and credit scoring

AssigneeID:

477463 ⎘