Third Dimension, Inc.

City:

Geneva, Ohio

Country:

United States

Published Applications:

Last publication date:

2014-12-04

Patent Grants:

Last grant date:

2017-10-03

Top Inventors for applications by Third Dimension, Inc.

These are the the leading inventors for applications assigned to Third Dimension, Inc.:

Louis G. DeJesus 3 Geneva, OH United States
Louis De Jesus 1 Geneva, OH United States
Doug Dean 1 Geneva, OH United States

Recent patent applications by Third Dimension, Inc.

Third Dimension, Inc. based in Geneva, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2014-12-04 ✅ Patent 9,776,767 granted on 2017-10-03

US20140353199A1

Performing operations; transporting

Packaging system and method

#2 | 2014-10-02 ✅ Patent 9,776,784 granted on 2017-10-03

US20140291195A1

Performing operations; transporting

Packaging system and method

#3 | 2014-10-02 ✅ Patent 10,513,384 granted on 2019-12-24

US20140290186A1

Performing operations; transporting

Packaging system and method

#4 | 2010-09-23 ✅ Patent 8,752,703 granted on 2014-06-17

US20100236968A1

Performing operations; transporting

Packaging system and method

Also check out THIRD DIMENSION, INC.'s (Geneva, United States) applicant profile with 3 patent applications submitted.

AssigneeID:

480154 ⎘