Nihon Almit Co., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2013-12-12

Patent Grants:

Last grant date:

2018-07-03

Top Inventors for applications by Nihon Almit Co., Ltd.

These are the the leading inventors for applications assigned to Nihon Almit Co., Ltd.:

Kazuhiko Kaneko 1 Tokyo, Japan
Yukio Maeda 1 Tokyo, Japan
Takeo Igarashi 1 Tokyo, Japan
Tadashi Sawamura 1 Tokyo, Japan

Recent patent applications by Nihon Almit Co., Ltd.

Nihon Almit Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2013-12-12 ✅ Patent 10,010,979 granted on 2018-07-03

US20130327444A1

Performing operations; transporting

Solder paste for bonding micro components

Also check out Nihon Almit Co., Ltd.'s (Tokyo, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

48168 ⎘