CMSC, Inc.

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2013-12-12

Patent Grants:

Last grant date:

2011-12-27

Top Inventors for applications by CMSC, Inc.

These are the the leading inventors for applications assigned to CMSC, Inc.:

Ching-Kuang Tzuang 4 Taipei, Taiwan
Meng-Ju Chiang 4 Taipei, Taiwan
Shian-Shun Wu 4 Taipei, Taiwan
Meng-Ju Chiang 3 Taipei City, Taiwan

Shian-Shun Wu 3 Taipei City, Taiwan
Ching-Kuang Tzuang 3 Taipei City, Taiwan
Yu-Min Lin 1 Kaohsiung City, Taiwan
Keng-Hung Lin 1 Hsinchu County, Taiwan

Ming-Lun Chang 1 Hsinchu County, Taiwan

Recent patent applications by CMSC, Inc.

CMSC, Inc. based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2013-12-12

US20130329374A1

Electricity

Pre-molded Cavity 3D Packaging Module with Layout

#2 | 2010-06-17 ✅ Patent 8,085,113 granted on 2011-12-27

US20100148885A1

Electricity

Complementary-conducting-strip coupled-line

#3 | 2010-06-10 ✅ Patent 8,183,961 granted on 2012-05-22

US20100141359A1

Electricity

Complementary-conducting-strip structure for miniaturizing microwave transmission line

#4 | 2010-05-06 ✅ Patent 8,106,729 granted on 2012-01-31

US20100109816A1

Electricity

Complementary-conducting-strip transmission line structure with plural stacked mesh ground planes

#5 | 2010-05-06 ✅ Patent 8,106,721 granted on 2012-01-31

US20100109790A1

Electricity

Multilayer complementary-conducting-strip transmission line structure with plural interlaced signal lines and mesh ground planes

AssigneeID:

48358 ⎘