St. Louis, Missouri
United States
6
2016-10-27
6
2018-03-06
These are the the leading inventors for applications assigned to Viasystems Technologies Corp., L.L.C.:
Viasystems Technologies Corp., L.L.C. based in St. Louis, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive cap
#2 | 2015-02-12 ✅ Patent 9,485,876 granted on 2016-11-01Methods of manufacturing printed circuit boards with stacked micro vias
#3 | 2014-02-20 ✅ Patent 9,736,948 granted on 2017-08-15Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies
#4 | 2013-07-18 ✅ Patent 9,012,811 granted on 2015-04-21Printed circuit board with embedded heater
#5 | 2011-12-22 ✅ Patent 9,017,540 granted on 2015-04-28Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards
#6 | 2011-02-24 ✅ Patent 8,950,063 granted on 2015-02-10Methods of manufacturing printed circuit boards with stacked micro vias
Also check out Viasystems Technologies Corp., LLC.'s (St. Louis, United States) applicant profile with 2 patent applications submitted.
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