Taichung
Taiwan
8
2018-10-11
8
2018-11-20
These are the the leading inventors for applications assigned to IBIS Innotech Inc.:
IBIS Innotech Inc. based in Taichung, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Package structure
#2 | 2017-09-07 ✅ Patent 9,859,193 granted on 2018-01-02Package structure
#3 | 2017-07-06 ✅ Patent 10,256,180 granted on 2019-04-09Package structure and manufacturing method of package structure
#4 | 2017-03-16 ✅ Patent 10,090,256 granted on 2018-10-02Semiconductor structure
#5 | 2016-12-01 ✅ Patent 9,801,282 granted on 2017-10-24Package structure
#6 | 2016-08-11 ✅ Patent 9,508,634 granted on 2016-11-29Package structure
#7 | 2015-12-24 ✅ Patent 9,451,694 granted on 2016-09-20Package substrate structure
#8 | 2013-03-14 ✅ Patent 8,985,807 granted on 2015-03-24Electrical connector and backlight module using the same
Also check out IBIS Innotech Inc.'s (Taichung, Taiwan) applicant profile with 7 patent applications submitted.
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