BONDTECH CO., LTD.

City:

Uji-shi

Country:

Japan

Published Applications:

Last publication date:

2015-02-19

Patent Grants:

Last grant date:

2015-09-22

Top Inventors for applications by BONDTECH CO., LTD.

These are the the leading inventors for applications assigned to BONDTECH CO., LTD.:

Tadatomo SUGA 1 , United States
Akira Yamauchi 1 Uji-shi, Japan
Tadatomo Suga 1 Nakano-ku, Japan
Akira Yamauchi 1 Uji, Japan

Recent patent applications by BONDTECH CO., LTD.

BONDTECH CO., LTD. based in Uji-shi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2015-02-19 ✅ Patent 9,142,532 granted on 2015-09-22

US20150048523A1

Electricity

Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer

Also check out BONDTECH CO., LTD.'s (Uji-shi, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

498616 ⎘