Pretium Packaging, L.L.C.

City:

St. Louis, Missouri

Country:

United States

Published Applications:

Last publication date:

2012-10-18

Patent Grants:

Last grant date:

2015-11-24

Top Inventors for applications by Pretium Packaging, L.L.C.

These are the the leading inventors for applications assigned to Pretium Packaging, L.L.C.:

Raymond C. Eble 1 Sugarloaf, PA United States

Recent patent applications by Pretium Packaging, L.L.C.

Pretium Packaging, L.L.C. based in St. Louis, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-10-18 ✅ Patent 9,193,495 granted on 2015-11-24

US20120261428A1

Performing operations; transporting

Blow mold tool with retractable base portion

AssigneeID:

501046 ⎘