Wolfgang Leitz

City:

Country:

Germany

Published Applications:

Last publication date:

2015-02-12

Patent Grants:

Last grant date:

2016-07-05

Top Inventors for applications by Wolfgang Leitz

These are the the leading inventors for applications assigned to Wolfgang Leitz:

Wolfgang Leitz based in , DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

Method and arrangement for recycling adhesive-containing film waste

AssigneeID:

509849 ⎘