ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Semiconductor package structure and method for manufacturing the same

#2 | 2020-07-23 ✅ Patent 10,872,915 granted on 2020-12-22

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Optical package structure and method for manufacturing the same

#3 | 2020-07-23 ✅ Patent 11,024,586 granted on 2021-06-01

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Semiconductor device package and method of manufacturing the same

#4 | 2015-07-30 ✅ Patent 9,891,048 granted on 2018-02-13

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Measurement equipment

#5 | 2014-01-09 ✅ Patent 8,889,488 granted on 2014-11-18

US20140011325A1

Method for manufacturing semiconductor package

#6 | 2009-05-21 ✅ Patent 7,829,977 granted on 2010-11-09

US20090127699A1

Low temperature co-fired ceramics substrate and semiconductor package

#7 | 2007-10-18 ✅ Patent 8,800,638 granted on 2014-08-12

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Heatsink and heatsink-positioning system

#8 | 2007-09-11 ✅ Patent 7,268,418 granted on 2007-09-11

US10747128

Multi-chips stacked package

#9 | 2007-08-28 ✅ Patent 7,261,828 granted on 2007-08-28

US10753318

Bumping process

#10 | 2007-08-28 ✅ Patent 7,262,497 granted on 2007-08-28

US10704719

Bumpless assembly package

#11 | 2007-08-02

US20070176278A1

Multi-chips stacked package

#12 | 2007-08-02

US20070176269A1

Multi-chips module package and manufacturing method thereof

#13 | 2007-07-31 ✅ Patent 7,250,677 granted on 2007-07-31

US11514827

Die package structure

#14 | 2007-07-26 ✅ Patent 7,446,404 granted on 2008-11-04

US20070172986A1

Three-dimensional package and method of making the same

#15 | 2007-07-19 ✅ Patent 7,514,771 granted on 2009-04-07

US20070164406A1

Leadless lead-frame

#16 | 2007-03-29 ✅ Patent 7,365,422 granted on 2008-04-29

US20070069345A1

Package of leadframe with heatsinks

#17 | 2007-03-01 ✅ Patent 7,491,568 granted on 2009-02-17

US20070048899A1

Wafer level package and method for making the same

#18 | 2006-12-21

US20060286791A1

Semiconductor wafer package and manufacturing method thereof

#19 | 2006-12-14 ✅ Patent 7,446,397 granted on 2008-11-04

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Leadless semiconductor package

#20 | 2006-12-05 ✅ Patent 7,144,801 granted on 2006-12-05

US10874237

Bumping process to increase bump height

#21 | 2006-10-17 ✅ Patent 7,122,459 granted on 2006-10-17

US10874238

Semiconductor wafer package and manufacturing method thereof

#22 | 2006-09-26 ✅ Patent 7,112,523 granted on 2006-09-26

US10753316

Bumping process

#23 | 2006-08-31

US20060192284A1

Method of forming an encapsulation layer on a back side of a wafer

#24 | 2006-07-04 ✅ Patent 7,072,780 granted on 2006-07-04

US10745576

Impedance standard substrate and correction method for vector network analyzer

#25 | 2006-06-22 ✅ Patent 7,291,926 granted on 2007-11-06

US20060131718A1

Multi-chip package structure

#26 | 2006-06-15 ✅ Patent 7,368,806 granted on 2008-05-06

US20060125113A1

Flip chip package with anti-floating structure

#27 | 2006-05-11 ✅ Patent 7,416,919 granted on 2008-08-26

US20060099735A1

Method for wafer level stack die placement

#28 | 2006-05-04

US20060094161A1

Thermal enhance package and manufacturing method thereof

#29 | 2006-05-04 ✅ Patent 7,218,006 granted on 2007-05-15

US20060091560A1

Multi-chip stack package

#30 | 2006-05-02 ✅ Patent 7,037,750 granted on 2006-05-02

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Method for manufacturing a package

#31 | 2006-04-27 ✅ Patent 7,235,989 granted on 2007-06-26

US20060087333A1

Electrical test device having isolation slot

#32 | 2006-04-27 ✅ Patent 7,446,409 granted on 2008-11-04

US20060087009A1

Cavity-down multiple-chip package

#33 | 2006-04-13 ✅ Patent 7,352,056 granted on 2008-04-01

US20060076658A1

Semiconductor package structure with microstrip antennan

#34 | 2006-04-04 ✅ Patent 7,023,079 granted on 2006-04-04

US10087432

Stacked semiconductor chip package

#35 | 2006-02-16 ✅ Patent 7,251,576 granted on 2007-07-31

US20060036391A1

System and method for testing CMOS image sensor

#36 | 2006-02-02 ✅ Patent 7,109,740 granted on 2006-09-19

US20060022697A1

Method for retesting semiconductor device

#37 | 2005-12-06 ✅ Patent 6,972,583 granted on 2005-12-06

US10144496

Method for testing electrical characteristics of bumps

#38 | 2005-10-20

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Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps

#39 | 2005-09-20 ✅ Patent 6,946,729 granted on 2005-09-20

US10417693

Wafer level package structure with a heat slug

#40 | 2005-09-13 ✅ Patent 6,942,478 granted on 2005-09-13

US10268161

Packaging mold with electrostatic discharge protection

#41 | 2005-08-18

US20050181538A1

Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof

#42 | 2005-08-16 ✅ Patent 6,929,980 granted on 2005-08-16

US10874273

Manufacturing method of flip chip package

#43 | 2005-08-16 ✅ Patent 6,930,389 granted on 2005-08-16

US10820829

Under bump metallization structure of a semiconductor wafer

#44 | 2005-08-04 ✅ Patent 7,193,282 granted on 2007-03-20

US20050168906A1

Contact sensor package

#45 | 2005-08-02 ✅ Patent 6,924,557 granted on 2005-08-02

US10327800

Semiconductor package

#46 | 2005-06-30 ✅ Patent 7,105,424 granted on 2006-09-12

US20050142837A1

Method for preparing arylphosphonite antioxidant

#47 | 2005-06-30 ✅ Patent 7,235,426 granted on 2007-06-26

US20050142696A1

Method of backside grinding a bumped wafer

#48 | 2005-06-30 ✅ Patent 7,253,529 granted on 2007-08-07

US20050140022A1

Multi-chip package structure

#49 | 2005-06-30

US20050139997A1

Chip assembly package

#50 | 2005-06-30 ✅ Patent 7,129,583 granted on 2006-10-31

US20050139979A1

Multi-chip package structure

#51 | 2005-06-30 ✅ Patent 7,193,302 granted on 2007-03-20

US20050139970A1

Leadless semiconductor package

#52 | 2005-06-21 ✅ Patent 6,908,842 granted on 2005-06-21

US10693888

Bumping process

#53 | 2005-06-16 ✅ Patent 7,115,484 granted on 2006-10-03

US20050130392A1

Method of dicing a wafer

#54 | 2005-06-09 ✅ Patent 7,045,391 granted on 2006-05-16

US20050121765A1

Multi-chips bumpless assembly package and manufacturing method thereof

#55 | 2005-05-12 ✅ Patent 7,015,571 granted on 2006-03-21

US20050098868A1

Multi-chips module assembly package

#56 | 2005-05-05 ✅ Patent 7,326,590 granted on 2008-02-05

US20050095752A1

Method for manufacturing ball grid array package

#57 | 2005-04-28 ✅ Patent 7,015,065 granted on 2006-03-21

US20050090043A1

Manufacturing method of ball grid array package

#58 | 2005-04-28 ✅ Patent 7,144,239 granted on 2006-12-05

US20050089594A1

Molding apparatus with a molding flowability sensor for packaging semiconductor device

#59 | 2005-04-21 ✅ Patent 7,187,070 granted on 2007-03-06

US20050082656A1

Stacked package module

#60 | 2005-04-12 ✅ Patent 6,879,031 granted on 2005-04-12

US10747189

Multi-chips package

#61 | 2005-04-12 ✅ Patent 6,878,963 granted on 2005-04-12

US10287336

Device for testing electrical characteristics of chips

#62 | 2005-04-07 ✅ Patent 7,102,241 granted on 2006-09-05

US20050073032A1

Leadless semiconductor package

#63 | 2005-03-31

US20050067720A1

Method of forming an encapsulation layer on a back side of a wafer

#64 | 2005-03-24 ✅ Patent 7,049,689 granted on 2006-05-23

US20050062142A1

Chip on glass package

#65 | 2005-03-17

US20050056933A1

Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof

#66 | 2005-03-03 ✅ Patent 7,291,924 granted on 2007-11-06

US20050046040A1

Flip chip stacked package

#67 | 2005-03-03 ✅ Patent 7,145,222 granted on 2006-12-05

US20050046008A1

Leadless semiconductor package

#68 | 2005-03-01 ✅ Patent 6,861,761 granted on 2005-03-01

US10697111

Multi-chip stack flip-chip package

#69 | 2005-02-24 ✅ Patent 7,033,914 granted on 2006-04-25

US20050042844A1

Method of making a package structure by dicing a wafer from the backside surface thereof

#70 | 2005-02-17 ✅ Patent 7,429,342 granted on 2008-09-30

US20050037178A1

Method for cleaning and regenerating a mold

#71 | 2005-02-15 ✅ Patent 6,856,027 granted on 2005-02-15

US10820826

Multi-chips stacked package

#72 | 2005-02-03 ✅ Patent 7,221,041 granted on 2007-05-22

US20050023667A1

Multi-chips module package and manufacturing method thereof

#73 | 2005-01-18 ✅ Patent 6,844,617 granted on 2005-01-18

US10292303

Packaging mold with electrostatic discharge protection

#74 | 2005-01-13 ✅ Patent 7,223,683 granted on 2007-05-29

US20050009317A1