Renesas Semiconductor Package & Test Solutions Co., Ltd.

City:

Gunma

Country:

Japan

Published Applications:

Last publication date:

2019-01-24

Patent Grants:

Last grant date:

2019-11-26

Top Inventors for applications by Renesas Semiconductor Package & Test Solutions Co., Ltd.

These are the the leading inventors for applications assigned to Renesas Semiconductor Package & Test Solutions Co., Ltd.:

Yukihiro SATOU 3 Takasaki, Japan
Tadatoshi Danno 3 Takasaki, Japan
Hajime HASEBE 3 Hakodate, Japan
Hiroshi INAGAWA 1 Maebashi, Japan

Yusuke Nakajima 1 Takasaki, Japan
Yusuke NAKAJIMA 1 Takasaki-shi, Japan
Yoshihiko Shimanuki 1 Nanyou, Japan
Kentaro OISHI 1 Tamamura, Japan

Nobuo MACHIDA 1 Takasakii, Japan

Recent patent applications by Renesas Semiconductor Package & Test Solutions Co., Ltd.

Renesas Semiconductor Package & Test Solutions Co., Ltd. based in Gunma, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-01-24 ✅ Patent 10,490,486 granted on 2019-11-26

US20190027427A1

Electricity

Semiconductor device

#2 | 2017-02-02 ✅ Patent 10,115,658 granted on 2018-10-30

US20170033033A1

Electricity

Semiconductor device

#3 | 2016-07-14 ✅ Patent 9,733,273 granted on 2017-08-15

US20160202293A1

Physics

Testing method for semiconductor manufacturing equipment

#4 | 2016-04-21 ✅ Patent 9,793,342 granted on 2017-10-17

US20160111490A1

Electricity

Insulated gate type semiconductor device and method for fabricating the same

#5 | 2015-08-13 ✅ Patent 9,484,288 granted on 2016-11-01

US20150228558A1

Electricity

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

#6 | 2014-03-27 ✅ Patent 9,496,204 granted on 2016-11-15

US20140084440A1

Electricity

Semiconductor device

Also check out Renesas Semiconductor Package & Test Solutions Co., Ltd.'s (Gunma, Japan) applicant profile with 3 patent applications submitted.

AssigneeID:

514750 ⎘