Japan
3
2020-03-05
3
2023-03-21
These are the the leading inventors for applications assigned to NIKKA SEIKO CO., LTD.:
NIKKA SEIKO CO., LTD. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Formulation and processing solution for dicing process, and method for processing
#2 | 2019-01-03 ✅ Patent 10,700,016 granted on 2020-06-30Protective film material for laser processing and wafer processing method using the protective film material
#3 | 2015-06-25 ✅ Patent 9,502,295 granted on 2016-11-22Protective film material for laser processing and wafer processing method using the protective film material
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