Viasystems, Inc.

City:

St. Louis, Missouri

Country:

United States

Published Applications:

Last publication date:

2014-01-02

Patent Grants:

Last grant date:

2016-12-20

Top Inventors for applications by Viasystems, Inc.

These are the the leading inventors for applications assigned to Viasystems, Inc.:

Roy J. Lecesse 1 St. Louis, MO United States

Recent patent applications by Viasystems, Inc.

Viasystems, Inc. based in St. Louis, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2014-01-02 ✅ Patent 9,526,184 granted on 2016-12-20

US20140001150A1

Electricity

Circuit board multi-functional hole system and method

AssigneeID:

516761 ⎘