Assignee profile:

STATS ChipPAC Pte. Ltd.

City:

Country:

Singapore

Published Applications:

8

Last publication date:

2023-10-26

Patent Grants:

8

Last grant date:

2024-09-24

Top Inventors for applications by STATS ChipPAC Pte. Ltd.

These are the the leading inventors for applications assigned to STATS ChipPAC Pte. Ltd.:

Recent patent applications by STATS ChipPAC Pte. Ltd.

STATS ChipPAC Pte. Ltd. based in , SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-10-26 ✅ Patent 12,100,663 granted on 2024-09-24
US20230343720A1
Electricity

Semiconductor device and method of integrating RF antenna interposer with semiconductor package

#2 | 2023-06-29 ✅ Patent 12,266,615 granted on 2025-04-01
US20230207485A1
Electricity

Selective EMI shielding using preformed mask with fang design

#3 | 2020-07-02 ✅ Patent 10,784,210 granted on 2020-09-22
US20200211976A1
Electricity

Semiconductor device with partial EMI shielding removal using laser ablation

#4 | 2019-03-21 ✅ Patent 10,468,384 granted on 2019-11-05
US20190088621A1
Electricity

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

#5 | 2019-02-14 ✅ Patent 10,662,056 granted on 2020-05-26
US20190047845A1
Performing operations; transporting

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

#6 | 2017-04-06 ✅ Patent 10,204,866 granted on 2019-02-12
US20170098612A1
Electricity

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

#7 | 2016-12-01 ✅ Patent 10,177,010 granted on 2019-01-08
US20160351419A1
Electricity

Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern

#8 | 2014-08-07 ✅ Patent 9,601,369 granted on 2017-03-21
US20140217609A1
Electricity

Semiconductor device and method of forming conductive vias with trench in saw street

AssigneeID:

520310 ⎘