ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Device for communication

#2 | 2020-10-27 ✅ Patent 10,818,586 granted on 2020-10-27

US16678784

Substrate structure and method of manufacturing the same

#3 | 2020-10-15 ✅ Patent 11,276,797 granted on 2022-03-15

US20200328322A1

Optical device and method of manufacturing the same

#4 | 2020-03-12 ✅ Patent 11,262,197 granted on 2022-03-01

US20200080841A1

Optical module and method of making the same

#5 | 2019-12-26 ✅ Patent 11,462,455 granted on 2022-10-04

US20190393126A1

Semiconductor package device and method of manufacturing the same

#6 | 2019-08-22 ✅ Patent 11,257,799 granted on 2022-02-22

US20190259741A1

Optical sensor module and method for manufacturing the same

#7 | 2019-05-16 ✅ Patent 11,398,421 granted on 2022-07-26

US20190148280A1

Semiconductor substrate and method for manufacturing the same

#8 | 2018-05-29 ✅ Patent 9,984,986 granted on 2018-05-29

US15432814

Semiconductor device and method of manufacturing the same

#9 | 2018-05-10 ✅ Patent 10,332,848 granted on 2019-06-25

US20180130758A1

Semiconductor package device and method of manufacturing the same

#10 | 2018-05-03 ✅ Patent 10,658,306 granted on 2020-05-19

US20180122750A1

Semiconductor package structure and method of manufacturing the same

#11 | 2018-03-15 ✅ Patent 10,526,200 granted on 2020-01-07

US20180072563A1

Semiconductor device package including cover including tilted inner sidewall

#12 | 2018-02-01 ✅ Patent 9,966,333 granted on 2018-05-08

US20180033719A1

Semiconductor substrate, semiconductor module and method for manufacturing the same

#13 | 2017-08-10 ✅ Patent 10,128,198 granted on 2018-11-13

US20170229402A1

Double side via last method for double embedded patterned substrate

#14 | 2017-05-18 ✅ Patent 10,170,658 granted on 2019-01-01

US20170141257A1

Semiconductor package structures and method of manufacturing the same

#15 | 2017-05-11 ✅ Patent 9,929,132 granted on 2018-03-27

US20170133360A1

Semiconductor device and process of making the same

#16 | 2017-05-04 ✅ Patent 10,395,997 granted on 2019-08-27

US20170125310A1

Semiconductor process

#17 | 2017-04-27 ✅ Patent 9,955,590 granted on 2018-04-24

US20170117240A1

Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and method of manufacturing the same

#18 | 2017-04-27 ✅ Patent 9,850,124 granted on 2017-12-26

US20170113922A1

Semiconductor device package for reducing parasitic light and method of manufacturing the same

#19 | 2017-04-20 ✅ Patent 10,508,935 granted on 2019-12-17

US20170108357A1

Optical module and manufacturing process thereof

#20 | 2017-03-16 ✅ Patent 9,812,387 granted on 2017-11-07

US20170077023A1

Semiconductor substrate, semiconductor module and method for manufacturing the same

#21 | 2017-03-16 ✅ Patent 10,689,249 granted on 2020-06-23

US20170073221A1

Semiconductor device package including a wall and a grounding ring exposed from the wall

#22 | 2017-02-09 ✅ Patent 9,768,139 granted on 2017-09-19

US20170040279A1

Semiconductor device and semiconductor package

#23 | 2017-02-07 ✅ Patent 9,564,393 granted on 2017-02-07

US14857931

Semiconductor device package and method of making the same

#24 | 2017-02-02 ✅ Patent 9,984,993 granted on 2018-05-29

US20170033075A1

Bonding structure for semiconductor package and method of manufacturing the same

#25 | 2017-01-26 ✅ Patent 9,922,938 granted on 2018-03-20

US20170025363A1

Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same

#26 | 2017-01-19 ✅ Patent 9,549,468 granted on 2017-01-17

US20170019993A1

Semiconductor substrate, semiconductor module and method for manufacturing the same

#27 | 2017-01-19 ✅ Patent 9,881,917 granted on 2018-01-30

US20170018550A1

Semiconductor device and method of manufacturing the same

#28 | 2017-01-05 ✅ Patent 9,653,407 granted on 2017-05-16

US20170005042A1

Semiconductor device packages

#29 | 2016-12-22 ✅ Patent 9,922,917 granted on 2018-03-20

US20160372397A1

Semiconductor package including substrates spaced by at least one electrical connecting element

#30 | 2016-12-08 ✅ Patent 10,157,855 granted on 2018-12-18

US20160358862A1

Semiconductor device including electric and magnetic field shielding

#31 | 2016-11-24 ✅ Patent 9,553,072 granted on 2017-01-24

US20160343672A1

Semiconductor device package and method of manufacturing the same

#32 | 2016-11-17 ✅ Patent 9,978,705 granted on 2018-05-22

US20160336287A1

Semiconductor substrate and semiconductor package structure having the same

#33 | 2016-11-03 ✅ Patent 10,083,902 granted on 2018-09-25

US20160322292A1

Semiconductor package structure and semiconductor process

#34 | 2016-10-27 ✅ Patent 9,659,853 granted on 2017-05-23

US20160315041A1

Double side via last method for double embedded patterned substrate

#35 | 2016-10-20 ✅ Patent 9,508,671 granted on 2016-11-29

US20160307864A1

Semiconductor device and semiconductor package

#36 | 2016-10-13 ✅ Patent 9,589,871 granted on 2017-03-07

US20160300782A1

Semiconductor package structure and method for manufacturing the same

#37 | 2016-10-06 ✅ Patent 9,570,381 granted on 2017-02-14

US20160293531A1

Semiconductor packages and related manufacturing methods

#38 | 2016-10-04 ✅ Patent 9,461,001 granted on 2016-10-04

US14805847

Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same

#39 | 2016-09-29 ✅ Patent 9,437,576 granted on 2016-09-06

US20160284665A1

Semiconductor device package and method of manufacturing the same

#40 | 2016-09-29 ✅ Patent 10,002,843 granted on 2018-06-19

US20160284659A1

Semiconductor substrate structure, semiconductor package and method of manufacturing the same

#41 | 2016-09-08 ✅ Patent 9,443,813 granted on 2016-09-13

US20160260677A1

Semiconductor device and method for manufacturing the same

#42 | 2016-09-01 ✅ Patent 9,589,906 granted on 2017-03-07

US20160254230A1

Semiconductor device package and method of manufacturing the same

#43 | 2016-08-18 ✅ Patent 9,496,238 granted on 2016-11-15

US20160240503A1

Sloped bonding structure for semiconductor package

#44 | 2016-08-18 ✅ Patent 9,653,415 granted on 2017-05-16

US20160240493A1

Semiconductor device packages and method of making the same

#45 | 2016-08-18 ✅ Patent 9,478,500 granted on 2016-10-25

US20160240481A1

Interposer substrate, semiconductor structure and fabricating process thereof

#46 | 2016-08-18 ✅ Patent 9,583,427 granted on 2017-02-28

US20160240469A1

Semiconductor substrate, semiconductor package structure and method of making the same

#47 | 2016-08-18 ✅ Patent 10,515,884 granted on 2019-12-24

US20160240462A1

Substrate having a conductive structure within photo-sensitive resin

#48 | 2016-07-28 ✅ Patent 9,484,307 granted on 2016-11-01

US20160218063A1

Fan-out wafer level packaging structure

#49 | 2016-06-30 ✅ Patent 9,437,565 granted on 2016-09-06

US20160190079A1

Semiconductor substrate and semiconductor package structure having the same

#50 | 2016-06-30 ✅ Patent 9,977,147 granted on 2018-05-22

US20160187530A1

Optical module, method of making the same and electronic device including the same

#51 | 2016-06-23 ✅ Patent 10,508,910 granted on 2019-12-17

US20160178366A1

Optical module and method of making the same

#52 | 2016-05-19 ✅ Patent 9,420,695 granted on 2016-08-16

US20160143149A1

Semiconductor package structure and semiconductor process

#53 | 2016-05-12 ✅ Patent 10,079,156 granted on 2018-09-18

US20160133562A1

Semiconductor package including dielectric layers defining via holes extending to component pads

#54 | 2016-03-17 ✅ Patent 9,984,989 granted on 2018-05-29

US20160079194A1

Semiconductor substrate and semiconductor package structure

#55 | 2016-03-17 ✅ Patent 9,748,196 granted on 2017-08-29

US20160079157A1

Semiconductor package structure including die and substrate electrically connected through conductive segments

#56 | 2016-03-03 ✅ Patent 9,721,899 granted on 2017-08-01

US20160064329A1

Embedded component package structure and method of manufacturing the same

#57 | 2016-03-03 ✅ Patent 11,264,367 granted on 2022-03-01

US20160061653A1

Electronic device, optical module and manufacturing process thereof

#58 | 2015-12-03 ✅ Patent 9,577,027 granted on 2017-02-21

US20150349048A1

Semiconductor device and process of making the same

#59 | 2015-11-17 ✅ Patent 9,190,367 granted on 2015-11-17

US14520914

Semiconductor package structure and semiconductor process

#60 | 2015-05-14 ✅ Patent 9,564,376 granted on 2017-02-07

US20150132867A1

Semiconductor process

#61 | 2015-04-30 ✅ Patent 10,181,438 granted on 2019-01-15

US20150115469A1

Semiconductor substrate mitigating bridging

#62 | 2015-04-02 ✅ Patent 11,091,365 granted on 2021-08-17

US20150091108A1

MEMS package structure and manufacturing method thereof

#63 | 2014-01-23 ✅ Patent 8,884,424 granted on 2014-11-11

US20140021636A1

Semiconductor package with single sided substrate design and manufacturing methods thereof

#64 | 2012-09-20 ✅ Patent 8,487,426 granted on 2013-07-16

US20120235309A1

Semiconductor package with embedded die and manufacturing methods thereof

#65 | 2012-06-21 ✅ Patent 9,406,658 granted on 2016-08-02

US20120153493A1

Embedded component device and manufacturing methods thereof

#66 | 2012-06-21 ✅ Patent 8,592,982 granted on 2013-11-26

US20120153489A1

Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof

#67 | 2012-05-17 ✅ Patent 8,941,222 granted on 2015-01-27

US20120119373A1

Wafer level semiconductor package and manufacturing methods thereof

#68 | 2012-03-29 ✅ Patent 8,698,307 granted on 2014-04-15

US20120074532A1

Semiconductor package with integrated metal pillars and manufacturing methods thereof

#69 | 2011-12-29 ✅ Patent 8,728,915 granted on 2014-05-20

US20110316122A1

Wafer laser-making method and die fabricated using the same

#70 | 2011-10-06 ✅ Patent 8,624,374 granted on 2014-01-07

US20110241193A1

Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof

#71 | 2011-07-14 ✅ Patent 8,569,894 granted on 2013-10-29

US20110169150A1

Semiconductor package with single sided substrate design and manufacturing methods thereof

#72 | 2011-06-02

US20110127654A1

Semiconductor Package and Manufacturing Methods Thereof

#73 | 2011-05-19 ✅ Patent 8,198,131 granted on 2012-06-12

US20110117700A1

Stackable semiconductor device packages

#74 | 2011-05-19 ✅ Patent 8,030,750 granted on 2011-10-04

US20110115066A1

Semiconductor device packages with electromagnetic interference shielding

#75 | 2011-01-27 ✅ Patent 8,193,647 granted on 2012-06-05

US20110018118A1

Semiconductor device package with an alignment mark

#76 | 2010-12-23 ✅ Patent 8,110,916 granted on 2012-02-07

US20100320593A1

Chip package structure and manufacturing methods thereof

#77 | 2010-08-19 ✅ Patent 8,212,339 granted on 2012-07-03

US20100207259A1

Semiconductor device packages with electromagnetic interference shielding

#78 | 2010-07-08 ✅ Patent 8,012,797 granted on 2011-09-06

US20100171207A1

Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries

#79 | 2010-07-08 ✅ Patent 8,076,765 granted on 2011-12-13

US20100171205A1

Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors

#80 | 2010-01-21 ✅ Patent 7,829,981 granted on 2010-11-09

US20100013064A1

Semiconductor device packages with electromagnetic interference shielding

#81 | 2009-10-15 ✅ Patent 7,989,928 granted on 2011-08-02

US20090256244A1

Semiconductor device packages with electromagnetic interference shielding

#82 | 2009-09-17 ✅ Patent 8,120,152 granted on 2012-02-21

US20090230525A1

Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof

#83 | 2009-09-17 ✅ Patent 8,492,883 granted on 2013-07-23

US20090230523A1

Semiconductor package having a cavity structure

#84 | 2009-08-06 ✅ Patent 8,022,511 granted on 2011-09-20

US20090194852A1

Semiconductor device packages with electromagnetic interference shielding

#85 | 2006-02-16 ✅ Patent 7,169,651 granted on 2007-01-30

US20060035414A1