E-SMILE Co., Ltd.

City:

Setagaya-ku, Tokyo

Country:

Japan

Published Applications:

Last publication date:

2016-09-22

Patent Grants:

Last grant date:

2017-06-20

Top Inventors for applications by E-SMILE Co., Ltd.

These are the the leading inventors for applications assigned to E-SMILE Co., Ltd.:

Jun Nakamura 1 Tokyo, Japan

Recent patent applications by E-SMILE Co., Ltd.

E-SMILE Co., Ltd. based in Setagaya-ku, Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2016-09-22 ✅ Patent 9,681,976 granted on 2017-06-20

US20160270942A1

Human necessities

Interdigital pad

AssigneeID:

524446 ⎘