Rayama Pack Co., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2015-12-03

Patent Grants:

Last grant date:

2017-08-22

Top Inventors for applications by Rayama Pack Co., Ltd.

These are the the leading inventors for applications assigned to Rayama Pack Co., Ltd.:

Yoshihiro RAYAMA 1 TOKYO, Japan

Recent patent applications by Rayama Pack Co., Ltd.

Rayama Pack Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2015-12-03 ✅ Patent 9,738,028 granted on 2017-08-22

US20150343699A1

Performing operations; transporting

Thermoforming apparatus with the use of a plastic sheet cassette

AssigneeID:

527390 ⎘