China
20
2023-06-22
20
2024-04-02
These are the the leading inventors for applications assigned to SHENGYI TECHNOLOGY CO., LTD.:
SHENGYI TECHNOLOGY CO., LTD. based in , CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same
#2 | 2023-02-16 ✅ Patent 12,122,904 granted on 2024-10-22Thermosetting resin composition and prepreg, laminate and printed circuit board using same
#3 | 2023-02-09 ✅ Patent 12,234,318 granted on 2025-02-25Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition
#4 | 2022-05-19 ✅ Patent 12,104,054 granted on 2024-10-01Resin composition, prepreg containing same, laminate, and printed circuit board
#5 | 2018-12-20 ✅ Patent 10,513,608 granted on 2019-12-24Process for preparing resin composition comprising benzoxazine, prepreg and laminate prepared therefrom
#6 | 2018-03-29 ✅ Patent 10,494,502 granted on 2019-12-03Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same
#7 | 2018-01-18 ✅ Patent 10,336,905 granted on 2019-07-02Organic silicon resin composition, white prepreg and white laminate using same
#8 | 2017-12-14 ✅ Patent 10,030,143 granted on 2018-07-24Ceramized silicone resin composition and pre-preg and laminate that use the composition
#9 | 2017-12-07 ✅ Patent 10,308,808 granted on 2019-06-04Organic silicone resin composition and pre-preg, laminate, copper-clad laminate, and aluminum substrate that use the composition
#10 | 2017-11-09 ✅ Patent 10,400,058 granted on 2019-09-03Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof
#11 | 2017-10-19 ✅ Patent 10,400,099 granted on 2019-09-03Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same
#12 | 2017-10-05 ✅ Patent 10,513,605 granted on 2019-12-24Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same
#13 | 2017-07-13 ✅ Patent 10,144,824 granted on 2018-12-04Halogen free resin composition and prepreg and laminated board prepared therefrom
#14 | 2016-09-15 ✅ Patent 10,053,547 granted on 2018-08-21Thermosetting resin composition and uses thereof
#15 | 2016-08-25 ✅ Patent 9,771,479 granted on 2017-09-26Halogen-free resin composition and use thereof
#16 | 2016-08-25 ✅ Patent 10,308,806 granted on 2019-06-04Resin composition and uses thereof in high frequency circuit boards
#17 | 2016-08-25 ✅ Patent 9,963,590 granted on 2018-05-08Halogen-free resin composition, and a prepreg and a laminate used for printed circuit using the same
#18 | 2016-06-30 ✅ Patent 9,752,028 granted on 2017-09-05Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same
#19 | 2015-10-29 ✅ Patent 10,149,380 granted on 2018-12-04Resin composition and its use
#20 | 2015-07-02 ✅ Patent 10,029,438 granted on 2018-07-24Thermosetting resin composition and use thereof
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