STATS ChipPAC Ptc. Ltd.

City:

Singapore

Country:

Singapore

Published Applications:

Last publication date:

2016-04-07

Patent Grants:

Last grant date:

2018-01-09

Top Inventors for applications by STATS ChipPAC Ptc. Ltd.

These are the the leading inventors for applications assigned to STATS ChipPAC Ptc. Ltd.:

HeeJo Chi 1 Yeoju-gun, South Korea
Zigmund Ramirez Camacho 1 Singapore, Singapore
Il Kwon Shim 1 Singapore, Singapore
JunMo Koo 1 Singapore, Singapore

Kyung Moon Kim 1 Seongnam, South Korea
Bartholomew Liao Chung Foh 1 Singapore, Singapore

Recent patent applications by STATS ChipPAC Ptc. Ltd.

STATS ChipPAC Ptc. Ltd. based in Singapore, SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2016-04-07 ✅ Patent 9,865,554 granted on 2018-01-09

US20160099222A1

Electricity

Integrated circuit packaging system with under bump metallization and method of manufacture thereof

AssigneeID:

533675 ⎘