BONDTECH CO., LTD.

City:

Country:

Japan

Published Applications:

Last publication date:

2018-03-08

Patent Grants:

Last grant date:

2019-02-12

Top Inventors for applications by BONDTECH CO., LTD.

These are the the leading inventors for applications assigned to BONDTECH CO., LTD.:

Akira Yamauchi 2 Kyoto, Japan
Tadatomo Suga 2 Tokyo, Japan

Recent patent applications by BONDTECH CO., LTD.

BONDTECH CO., LTD. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2018-03-08 ✅ Patent 10,204,785 granted on 2019-02-12

US20180068854A1

Electricity

Substrate bonding apparatus and substrate bonding method

#2 | 2017-02-16 ✅ Patent 9,870,922 granted on 2018-01-16

US20170047225A1

Electricity

Substrate bonding apparatus and substrate bonding method

AssigneeID:

533947 ⎘