TONGFU MICROELECTRONICS CO., LTD.

City:

Natong

Country:

China

Published Applications:

Last publication date:

2017-06-29

Patent Grants:

Last grant date:

2018-03-20

Top Inventors for applications by TONGFU MICROELECTRONICS CO., LTD.

These are the the leading inventors for applications assigned to TONGFU MICROELECTRONICS CO., LTD.:

Guohua Gao 1 Nantong, China

Recent patent applications by TONGFU MICROELECTRONICS CO., LTD.

TONGFU MICROELECTRONICS CO., LTD. based in Natong, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2017-06-29 ✅ Patent 9,922,950 granted on 2018-03-20

US20170186717A1

Electricity

Method and structure for wafer-level packaging

AssigneeID:

536484 ⎘