Japan
26
2019-10-31
26
2020-03-24
These are the the leading inventors for applications assigned to ABLIC Inc.:
ABLIC Inc. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Resin-encapsulated semiconductor device and method of manufacturing the same
#2 | 2018-11-08 ✅ Patent 10,593,724 granted on 2020-03-17Method of manufacturing a semiconductor device
#3 | 2018-10-11 ✅ Patent 10,497,662 granted on 2019-12-03Semiconductor device and ball bonder
#4 | 2018-10-04 ✅ Patent 10,205,031 granted on 2019-02-12Semiconductor device having resistance voltage dividing circuit
#5 | 2018-10-04 ✅ Patent 10,354,968 granted on 2019-07-16Resin-encapsulated semiconductor device and method of manufacturing the same
#6 | 2018-08-23 ✅ Patent 10,580,708 granted on 2020-03-03Method of manufacturing a semiconductor device and semiconductor device
#7 | 2018-06-07 ✅ Patent 10,236,269 granted on 2019-03-19Semiconductor device having semiconductor chip with large and small irregularities on upper and lower side surface portions thereof
#8 | 2018-03-29 ✅ Patent 10,068,910 granted on 2018-09-04Non-volatile semiconductor memory device
#9 | 2018-03-29 ✅ Patent 10,014,253 granted on 2018-07-03Method of manufacturing semiconductor integrated circuit device
#10 | 2018-02-15 ✅ Patent 10,300,577 granted on 2019-05-28Polishing head, CMP apparatus including a polishing head, and manufacturing method of semiconductor integrated circuit device using a CMP apparatus
#11 | 2017-11-09 ✅ Patent 10,014,287 granted on 2018-07-03Semiconductor device
#12 | 2017-09-21 ✅ Patent 10,504,957 granted on 2019-12-10Semiconductor device with hall elements and magnetic flux concentrator
#13 | 2017-09-21 ✅ Patent 10,290,677 granted on 2019-05-14Semiconductor device having hall elements formed in a semiconductor substrate and a magnetic body flux concentrator
#14 | 2017-09-21 ✅ Patent 10,249,713 granted on 2019-04-02Semiconductor device including an ESD protection element
#15 | 2017-09-07 ✅ Patent 10,340,397 granted on 2019-07-02Optical sensor device
#16 | 2017-08-31 ✅ Patent 10,043,749 granted on 2018-08-07Semiconductor device
#17 | 2017-08-03 ✅ Patent 10,438,944 granted on 2019-10-08Semiconductor device having ESD element
#18 | 2017-03-30 ✅ Patent 10,504,755 granted on 2019-12-10Semiconductor-substrate processing apparatus, method of stripping a photoresist, and method of manufacturing a semiconductor device
#19 | 2017-03-16 ✅ Patent 10,411,137 granted on 2019-09-10Semiconductor memory device and method of manufacturing the same
#20 | 2017-02-09 ✅ Patent 10,118,273 granted on 2018-11-06Polishing head, CMP apparatus having polishing head, and semiconductor integrated circuit manufacturing method using CMP apparatus
#21 | 2017-01-05 ✅ Patent 10,504,867 granted on 2019-12-10Semiconductor device having a bonding pad
#22 | 2016-12-22 ✅ Patent 10,014,294 granted on 2018-07-03Semiconductor integrated circuit device having enhancement type NMOS and depression type MOS with N-type channel impurity region and P-type impurity layer under N-type channel impurity region
#23 | 2016-09-22 ✅ Patent 10,205,087 granted on 2019-02-12Semiconductor device
#24 | 2016-09-08 ✅ Patent 10,191,006 granted on 2019-01-29Humidity sensor
#25 | 2016-06-16 ✅ Patent 10,850,334 granted on 2020-12-01Mold for resin sealing a semiconductor chip, and semiconductor device having resin-sealed semiconductor chip
#26 | 2016-05-26 ✅ Patent 10,573,936 granted on 2020-02-25Remaining battery life prediction device and battery pack
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