Assignee profile:

ABLIC Inc.

City:

Country:

Japan

Published Applications:

26

Last publication date:

2019-10-31

Patent Grants:

26

Last grant date:

2020-03-24

Top Inventors for applications by ABLIC Inc.

These are the the leading inventors for applications assigned to ABLIC Inc.:

Recent patent applications by ABLIC Inc.

ABLIC Inc. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-10-31 ✅ Patent 10,600,752 granted on 2020-03-24
US20190333888A1
Electricity

Resin-encapsulated semiconductor device and method of manufacturing the same

#2 | 2018-11-08 ✅ Patent 10,593,724 granted on 2020-03-17
US20180323233A1
Electricity

Method of manufacturing a semiconductor device

#3 | 2018-10-11 ✅ Patent 10,497,662 granted on 2019-12-03
US20180294243A1
Electricity

Semiconductor device and ball bonder

#4 | 2018-10-04 ✅ Patent 10,205,031 granted on 2019-02-12
US20180286990A1
Electricity

Semiconductor device having resistance voltage dividing circuit

#5 | 2018-10-04 ✅ Patent 10,354,968 granted on 2019-07-16
US20180286827A1
Electricity

Resin-encapsulated semiconductor device and method of manufacturing the same

#6 | 2018-08-23 ✅ Patent 10,580,708 granted on 2020-03-03
US20180240721A1
Electricity

Method of manufacturing a semiconductor device and semiconductor device

#7 | 2018-06-07 ✅ Patent 10,236,269 granted on 2019-03-19
US20180158792A1
Electricity

Semiconductor device having semiconductor chip with large and small irregularities on upper and lower side surface portions thereof

#8 | 2018-03-29 ✅ Patent 10,068,910 granted on 2018-09-04
US20180090506A1
Electricity

Non-volatile semiconductor memory device

#9 | 2018-03-29 ✅ Patent 10,014,253 granted on 2018-07-03
US20180090437A1
Electricity

Method of manufacturing semiconductor integrated circuit device

#10 | 2018-02-15 ✅ Patent 10,300,577 granted on 2019-05-28
US20180043496A1
Performing operations; transporting

Polishing head, CMP apparatus including a polishing head, and manufacturing method of semiconductor integrated circuit device using a CMP apparatus

#11 | 2017-11-09 ✅ Patent 10,014,287 granted on 2018-07-03
US20170323878A1
Electricity

Semiconductor device

#12 | 2017-09-21 ✅ Patent 10,504,957 granted on 2019-12-10
US20170271401A1
Electricity

Semiconductor device with hall elements and magnetic flux concentrator

#13 | 2017-09-21 ✅ Patent 10,290,677 granted on 2019-05-14
US20170271400A1
Electricity

Semiconductor device having hall elements formed in a semiconductor substrate and a magnetic body flux concentrator

#14 | 2017-09-21 ✅ Patent 10,249,713 granted on 2019-04-02
US20170271321A1
Electricity

Semiconductor device including an ESD protection element

#15 | 2017-09-07 ✅ Patent 10,340,397 granted on 2019-07-02
US20170256658A1
Electricity

Optical sensor device

#16 | 2017-08-31 ✅ Patent 10,043,749 granted on 2018-08-07
US20170250136A1
Electricity

Semiconductor device

#17 | 2017-08-03 ✅ Patent 10,438,944 granted on 2019-10-08
US20170221878A1
Electricity

Semiconductor device having ESD element

#18 | 2017-03-30 ✅ Patent 10,504,755 granted on 2019-12-10
US20170092512A1
Electricity

Semiconductor-substrate processing apparatus, method of stripping a photoresist, and method of manufacturing a semiconductor device

#19 | 2017-03-16 ✅ Patent 10,411,137 granted on 2019-09-10
US20170077309A1
Electricity

Semiconductor memory device and method of manufacturing the same

#20 | 2017-02-09 ✅ Patent 10,118,273 granted on 2018-11-06
US20170036318A1
Performing operations; transporting

Polishing head, CMP apparatus having polishing head, and semiconductor integrated circuit manufacturing method using CMP apparatus

#21 | 2017-01-05 ✅ Patent 10,504,867 granted on 2019-12-10
US20170005024A1
Electricity

Semiconductor device having a bonding pad

#22 | 2016-12-22 ✅ Patent 10,014,294 granted on 2018-07-03
US20160372465A1
Electricity

Semiconductor integrated circuit device having enhancement type NMOS and depression type MOS with N-type channel impurity region and P-type impurity layer under N-type channel impurity region

#23 | 2016-09-22 ✅ Patent 10,205,087 granted on 2019-02-12
US20160276577A1
Electricity

Semiconductor device

#24 | 2016-09-08 ✅ Patent 10,191,006 granted on 2019-01-29
US20160258894A1
Physics

Humidity sensor

#25 | 2016-06-16 ✅ Patent 10,850,334 granted on 2020-12-01
US20160172316A1
Electricity

Mold for resin sealing a semiconductor chip, and semiconductor device having resin-sealed semiconductor chip

#26 | 2016-05-26 ✅ Patent 10,573,936 granted on 2020-02-25
US20160149272A1
Electricity

Remaining battery life prediction device and battery pack

AssigneeID:

541195 ⎘