ANDAQ TECHNOLOGY CO., LTD.

City:

Taipei

Country:

Taiwan

Published Applications:

Last publication date:

2020-03-26

Patent Grants:

Last grant date:

2021-03-16

Top Inventors for applications by ANDAQ TECHNOLOGY CO., LTD.

These are the the leading inventors for applications assigned to ANDAQ TECHNOLOGY CO., LTD.:

Chia-Yu Wu 2 New Taipei, Taiwan
Chia-Yu WU 2 New Taipei City, Taiwan
CHING-FENG LIN 1 HSINCHU COUNTY, Taiwan

Recent patent applications by ANDAQ TECHNOLOGY CO., LTD.

ANDAQ TECHNOLOGY CO., LTD. based in Taipei, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2020-03-26 ✅ Patent 10,950,390 granted on 2021-03-16

US20200098527A1

Electricity

Stacked type capacitor without carbon paste layer, manufacturing method thereof and silver paste layer

#2 | 2020-03-26 ✅ Patent 10,923,289 granted on 2021-02-16

US20200098526A1

Electricity

Stacked type capacitor package structure without carbon paste layer, stacked type capacitor thereof, and polymer composite layer

#3 | 2017-08-17 ✅ Patent 10,098,268 granted on 2018-10-09

US20170238447A1

Electricity

Electromagnetic wave shielding tape using nanomaterials

Also check out ANDAQ TECHNOLOGY CO., LTD.'s (Taipei, Taiwan) applicant profile with 3 patent applications submitted.

AssigneeID:

545371 ⎘