SUPERUFO291 TEC

City:

Kyoto

Country:

Japan

Published Applications:

Last publication date:

2023-12-07

Patent Grants:

Last grant date:

2024-10-15

Top Inventors for applications by SUPERUFO291 TEC

These are the the leading inventors for applications assigned to SUPERUFO291 TEC:

Akira FUKUI 2 Kyoto-shi, Japan
Akira Fukui 2 Kyoto, Japan
Toshie FUKUI 1 Kyoto-shi, Japan
Toshie Fukui 1 Kyoto, Japan

Recent patent applications by SUPERUFO291 TEC

SUPERUFO291 TEC based in Kyoto, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-12-07 ✅ Patent 12,119,322 granted on 2024-10-15

US20230395550A1

Electricity

Bonding member for semiconductor device

#2 | 2016-11-17 ✅ Patent 10,115,655 granted on 2018-10-30

US20160336253A1

Electricity

Heat dissipation substrate and method for producing heat dissipation substrate

Also check out SUPERUFO291 TEC's (Kyoto, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

546272 ⎘