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Assignee profile:

Ormet Circuits, Inc.

City:

San Diego, California

Country:

United States

Published Applications:

13

Last publication date:

2023-02-16

Patent Grants:

12

Last grant date:

2026-03-03

Top Inventors for applications by Ormet Circuits, Inc.

These are the the leading inventors for applications assigned to Ormet Circuits, Inc.:

Recent patent applications by Ormet Circuits, Inc.

Ormet Circuits, Inc. based in San Diego, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-02-16 ✅ Patent 12,564,907 granted on 2026-03-03
US20230049614A1
Performing operations; transporting

INDIUM SOLDER PASTE COMPOSITIONS

 #2 | 2022-10-20 ✅ Patent 12,388,004 granted on 2025-08-12
US20220336341A1
Electricity

LITHOGRAPHICALLY DEFINED ELECTRICAL INTERCONNECTS FROM CONDUCTIVE PASTES

 #3 | 2021-04-22 ✅ Patent 11,217,554 granted on 2022-01-04
US20210118836A1
Electricity

Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof

 #4 | 2020-06-11 ✅ Patent 12,053,934 granted on 2024-08-06
US20200180233A1
Performing operations; transporting

Conductive film adhesive

 #5 | 2018-12-13 ✅ Patent 10,727,193 granted on 2020-07-28
US20180358318A1
Electricity

Sintering pastes with high metal loading for semiconductor die attach applications

 #6 | 2016-12-22 ✅ Patent 11,440,142 granted on 2022-09-13
US20160368103A1
Performing operations; transporting

Alternative compositions for high temperature soldering applications

 #7 | 2014-08-21 ✅ Patent 9,545,017 granted on 2017-01-10
US20140231126A1
Electricity

Structures for z-axis interconnection of multilayer electronic substrates

 #8 | 2014-05-15 ✅ Patent 9,583,453 granted on 2017-02-28
US20140131898A1
Electricity

Semiconductor packaging containing sintering die-attach material

 #9 | 2014-05-01
US20140120356A1
Chemistry; metallurgy

CONDUCTIVE FILM ADHESIVE

 #10 | 2014-02-13 ✅ Patent 9,005,330 granted on 2015-04-14
US20140042212A1
Performing operations; transporting

Electrically conductive compositions comprising non-eutectic solder alloys

 #11 | 2011-07-14 ✅ Patent 8,840,700 granted on 2014-09-23
US20110171372A1
Electricity

Preparation of metallurgic network compositions and methods of use thereof

 #12 | 2010-10-07 ✅ Patent 8,221,518 granted on 2012-07-17
US20100252616A1
Performing operations; transporting

Conductive compositions containing blended alloy fillers

 #13 | 2010-09-16 ✅ Patent 9,003,648 granted on 2015-04-14
US20100230145A1
Electricity

Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias

Also check out ORMET CIRCUITS, INC.'s (San Diego, United States) applicant profile with 10 patent applications submitted.

AssigneeID:

54760 ⎘