SHIN-CHU
Taiwan
9
2017-11-28
7
2017-11-28
These are the the leading inventors for applications assigned to SIGURD MICROELECTRONICS CORP.:
SIGURD MICROELECTRONICS CORP. based in SHIN-CHU, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Wafer-level package with metal shielding structure and the manufacturing method thereof
#2 | 2014-02-13OPTICAL PACKAGE MODULE
#3 | 2012-02-02COMPACT SENSOR PACKAGE STRUCTURE
#4 | 2008-08-07 ✅ Patent 7,547,571 granted on 2009-06-16Packaging method of a light-sensing semiconductor device and packaging structure thereof
#5 | 2007-11-20 ✅ Patent 7,297,918 granted on 2007-11-20Image sensor package structure and image sensing module
#6 | 2007-04-26 ✅ Patent 7,405,456 granted on 2008-07-29Optical sensor chip package
#7 | 2007-03-22 ✅ Patent 7,323,675 granted on 2008-01-29Packaging structure of a light-sensing device with a spacer wall
#8 | 2007-03-15 ✅ Patent 7,282,788 granted on 2007-10-16Image sensing chip package structure
#9 | 2006-11-02 ✅ Patent 7,358,482 granted on 2008-04-15Packaging structure of a light-sensing element and fabrication method thereof
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