Daejeon
South Korea
9
2013-02-14
6
2014-03-04
These are the the leading inventors for applications assigned to WAVENICS INC.:
WAVENICS INC. based in Daejeon, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Terminal-integrated metal base package module and terminal-integrated metal base packaging method
#2 | 2013-01-24 ✅ Patent 8,497,586 granted on 2013-07-30Package module structure for high power device with metal substrate and method of manufacturing the same
#3 | 2012-05-03METHOD OF MANUFACTURING METAL BASE PACKAGE WITH VIA
#4 | 2011-02-17 ✅ Patent 8,034,664 granted on 2011-10-11Method of fabricating passive device applied to the three-dimensional package module
#5 | 2010-06-10 ✅ Patent 7,838,380 granted on 2010-11-23Method for manufacturing passive device and semiconductor package using thin metal piece
#6 | 2010-06-03 ✅ Patent 8,120,045 granted on 2012-02-21Metal-based photonic device package module
#7 | 2009-07-09MULTI-LAYER PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
#8 | 2009-06-11HIGH EFFICIENCY LED WITH MULTI-LAYER REFLECTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
#9 | 2009-02-05 ✅ Patent 7,851,918 granted on 2010-12-14Three-dimensional package module
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