Anaheim, California
United States
6
2014-02-20
6
2017-08-15
These are the the leading inventors for applications assigned to DDi Global Corp.:
DDi Global Corp. based in Anaheim, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies
#2 | 2012-06-14 ✅ Patent 8,510,941 granted on 2013-08-20Methods of manufacturing a printed wiring board having copper wrap plated hole
#3 | 2012-01-05 ✅ Patent 8,567,053 granted on 2013-10-29Methods of manufacturing printed circuit boards
#4 | 2011-09-20 ✅ Patent 8,020,292 granted on 2011-09-20Methods of manufacturing printed circuit boards
#5 | 2008-12-11 ✅ Patent 8,156,645 granted on 2012-04-17Method of manufacturing a multilayer printed wiring board with copper wrap plated hole
#6 | 2008-08-21 ✅ Patent 8,250,751 granted on 2012-08-28Method of manufacturing a printed circuit board
Also check out DDi Global Corp.'s (Anaheim, United States) applicant profile with 1 patent applications submitted.
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