Hsiao-Lei Wang

City:

Taoyuan

Country:

Taiwan

Published Applications:

Last publication date:

2024-02-01

Patent Grants:

Last grant date:

2025-05-06

Top Inventors for applications by Hsiao-Lei Wang

These are the the leading inventors for applications assigned to Hsiao-Lei Wang:

Hsiao-Lei WANG 2 Taoyuan, Taiwan
Kao-Mei SUNG 2 Taoyuan, Taiwan
Kao-Mei Sung 1 Taoyuan City, Taiwan
Po-Yen Liu 1 Taoyuan City, Taiwan

Hsiao-Lei Wang 1 Taoyuan City, Taiwan
Po-Yen Liu 1 Taoyuan, Taiwan
Neng-Tai SHIH 1 New Taipei, Taiwan

Recent patent applications by Hsiao-Lei Wang

Hsiao-Lei Wang based in Taoyuan, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-02-01 ✅ Patent 12,295,185 granted on 2025-05-06

US20240038931A1

Electricity

Epitaxial substrate having a 2D material interposer, method for manufacturing the epitaxial substrate, and device prepared from the epitaxial substrate

#2 | 2019-01-03 ✅ Patent 10,297,446 granted on 2019-05-21

US20190006177A1

Electricity

Encapsulated substrate, manufacturing method, high band-gap device having encapsulated substrate

Also check out Hsiao-Lei Wang's (Taoyuan, Taiwan) applicant profile with 2 patent applications submitted.

AssigneeID:

555446 ⎘