TECHCYCLE PACKAGING TECHNOLOGY (SHANGHAI) CO., LTD.

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2019-04-25

Patent Grants:

Last grant date:

2019-08-06

Top Inventors for applications by TECHCYCLE PACKAGING TECHNOLOGY (SHANGHAI) CO., LTD.

These are the the leading inventors for applications assigned to TECHCYCLE PACKAGING TECHNOLOGY (SHANGHAI) CO., LTD.:

HUALONG WANG 1 SHANGHAI, China

Recent patent applications by TECHCYCLE PACKAGING TECHNOLOGY (SHANGHAI) CO., LTD.

TECHCYCLE PACKAGING TECHNOLOGY (SHANGHAI) CO., LTD. based in Shanghai, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-04-25 ✅ Patent 10,370,144 granted on 2019-08-06

US20190118999A1

Performing operations; transporting

Foldable tray

Also check out TECHCYCLE PACKAGING TECHNOLOGY (SHANGHAI) CO., LTD.'s (Shanghai, China) applicant profile with 1 patent applications submitted.

AssigneeID:

558995 ⎘