Hsinchu
Taiwan
4
2022-07-21
4
2023-12-26
These are the the leading inventors for applications assigned to TAIWAN SEMICONDUCTOR MANUFACTURING:
TAIWAN SEMICONDUCTOR MANUFACTURING based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Hybrid micro-bump integration with redistribution layer
#2 | 2021-12-09 ✅ Patent 11,735,426 granted on 2023-08-22Semiconductor device and method of manufacture
#3 | 2018-05-31 ✅ Patent 10,879,120 granted on 2020-12-29Self aligned via and method for fabricating the same
#4 | 2017-11-30 ✅ Patent 10,516,051 granted on 2019-12-24FinFET and method of fabrication thereof
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