Shiga
Japan
2
2018-07-26
2
2020-02-04
These are the the leading inventors for applications assigned to FUTURE LABO CO, LTD.:
FUTURE LABO CO, LTD. based in Shiga, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Bend-open package and method for manufacturing bend-open package
#2 | 2017-11-09 ✅ Patent 10,661,962 granted on 2020-05-26Peel-openable package and opening structure for peel-openable package
Also check out FUTURE LABO CO., LTD.'s (Shiga, Japan) applicant profile with 2 patent applications submitted.
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