Assignee profile:

Rundpack AG

City:

Diepoldsau

Country:

Switzerland

Published Applications:

5

Last publication date:

2014-07-24

Patent Grants:

4

Last grant date:

2015-01-27

Top Inventors for applications by Rundpack AG

These are the the leading inventors for applications assigned to Rundpack AG:

Also check out Rundpack AG's (Diepoldsau, Switzerland) applicant profile with 1 patent applications submitted.

AssigneeID:

56914 ⎘