China
6
2022-03-24
6
2024-11-19
These are the the leading inventors for applications assigned to JCET Semiconductor (Shaoxing) Co., Ltd.:
JCET Semiconductor (Shaoxing) Co., Ltd. based in , CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Semiconductor device and method of forming ultra high density embedded semiconductor die package
#2 | 2018-01-18 ✅ Patent 10,665,534 granted on 2020-05-26Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package
#3 | 2017-08-17 ✅ Patent 10,607,946 granted on 2020-03-31Semiconductor device and method of forming interconnect substrate for FO-WLCSP
#4 | 2017-01-19 ✅ Patent 10,643,952 granted on 2020-05-05Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#5 | 2016-10-06 ✅ Patent 10,651,139 granted on 2020-05-12Semiconductor device and method of forming wafer level ground plane and power ring
#6 | 2016-05-19 ✅ Patent 10,622,293 granted on 2020-04-14Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)
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