WINGO TECHNOLOGY CO., LTD.

City:

Okayama

Country:

Japan

Published Applications:

Last publication date:

2022-05-26

Patent Grants:

Last grant date:

2025-04-08

Top Inventors for applications by WINGO TECHNOLOGY CO., LTD.

These are the the leading inventors for applications assigned to WINGO TECHNOLOGY CO., LTD.:

Toshiyuki Goshima 4 Okayama, Japan
Maw Soe Win 3 Okayama, Japan
Win Maw Soe 3 Okayama, Japan
Toshiyuki GOSHIMA 1 Okayama-shi, Okayama-ken, Japan

Win Maw SOE 1 Okayama-shi, Okayama-ken, Japan

Recent patent applications by WINGO TECHNOLOGY CO., LTD.

WINGO TECHNOLOGY CO., LTD. based in Okayama, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-05-26 ✅ Patent 12,269,949 granted on 2025-04-08

US20220162445A1

Chemistry; metallurgy

Polyimide compound and molded article comprising the polyimide compound

#2 | 2020-08-20 ✅ Patent 11,124,474 granted on 2021-09-21

US20200262783A1

Chemistry; metallurgy

Diamine compound, and polyimide compound and molded product using the same

#3 | 2020-08-20 ✅ Patent 11,136,286 granted on 2021-10-05

US20200262782A1

Chemistry; metallurgy

Diamine compound, and polyimide compound and molded product using the same

#4 | 2019-12-26 ✅ Patent 10,683,259 granted on 2020-06-16

US20190389795A1

Chemistry; metallurgy

Diamine compound, and polyimide compound and molded product using the same

Also check out WINGO TECHNOLOGY CO., LTD.'s (Okayama, Japan) applicant profile with 4 patent applications submitted.

AssigneeID:

574102 ⎘