GlobaWafers Co., Ltd.

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2019-10-31

Patent Grants:

Last grant date:

2020-08-25

Top Inventors for applications by GlobaWafers Co., Ltd.

These are the the leading inventors for applications assigned to GlobaWafers Co., Ltd.:

Sasha Kweskin 1 St. Louis, MO United States
Charles R. Lottes 1 Ballwin, MO United States
Gang Wang 1 Grover, MO United States

Recent patent applications by GlobaWafers Co., Ltd.

GlobaWafers Co., Ltd. based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-10-31 ✅ Patent 10,755,966 granted on 2020-08-25

US20190333804A1

Electricity

Manufacturing method of smoothing a semiconductor surface

AssigneeID:

577667 ⎘